100-layer ultra-high multilayer printed circuit board manufacturing technology
The inner layer copper foil thickness can use 1/2 oz (18 μm) and in some cases 1 oz (35 μm)!
We would like to introduce our "100-layer Ultra High Multi-layer Printed Circuit Board Manufacturing Technology." Through high-precision lamination technology using ultra-thin materials, we have achieved high multi-layer printed circuit boards with over 100 layers, utilizing core materials of 30μm and prepreg of 20μm, resulting in a board thickness of 7.6mm for a 110-layer board. Additionally, our high-precision lamination technology allows us to accommodate narrow pitch specifications with a 0.5mm pitch. Please feel free to contact us if you have any inquiries. 【Features】 ■ Achieved a 110-layer board with a thickness of 7.6mm by using core materials of 30μm and prepreg of 20μm ■ Inner layer copper foil thickness can be 1/2oz (18μm) and in some cases, 1oz (35μm) can be used ■ Capable of accommodating narrow pitch specifications with a 0.5mm pitch due to high-precision lamination technology *For more details, please refer to the PDF document or feel free to contact us.
- Company：OKIサーキットテクノロジー
- Price：Other
